01
Broadband design approach
Broadband amplification supports a span of RF signals within a module’s intended operating range. The family offers different design paths; one module should not be assumed to cover every application.
COMPONENT ENGINEERING / RF AMPLIFICATION
Broadband RF Power
Amplifier Modules
Module-level RF amplification for communications, laboratory testing and industrial research. Explore the product family, understand GaN and LDMOS technology paths, and discuss a configuration around your system.
PRODUCT PHOTOGRAPH / MODULE VIEW
RF MODULES / MODEL SELECTION
Model selection reference
Browse 22 reference entries and open each independent model page. The reference numbers preserve the supplied list's order; they are not confirmed commercial model codes.
| Reference model | Frequency reference | Bandwidth reference | Power reference | Transistor technology | RF connector | Weight reference | Dimensions reference | Record status | Details |
|---|---|---|---|---|---|---|---|---|---|
| Reference model 01 | 5–6 GHz | 1 GHz | 10-30 W | GaN | SMA → SMA | 273 g | 132 × 53 × 18 mm | Recorded fields | View model details |
| Reference model 02 | 1.2 GHz 1.5 GHz 2.4 GHz | Lower-band bandwidth200 MHz (e.g.700–900 MHz) Upper-band bandwidth300 MHz (e.g.2–2.3 GHz) | 50 W | LDMOS | SMA → N | 556 g | 179.6 × 66.91 × 22 mm | Recorded fields | View model details |
| Reference model 03 | 3–4 GHz 4–5 GHz 5–6 GHz 3–6 GHz | Bandwidth1 GHz Bandwidth3 GHz | 50 W | GaN | SMA → N | Not provided — confirm | 203.5 × 90 × 24 mm | Confirmation required | View model details |
| Reference model 04 | 100–1000 MHz | Bandwidth1 GHz | 100 W | LDMOS (new revision) | SMA → N | 1020 g | 175.5 × 100 × 24 mm | Recorded fields | View model details |
| Reference model 05 | 1–2 GHz 2–3 GHz 1–3 GHz | Bandwidth1 GHz Bandwidth3 GHz | 100 W | GaN | SMA → N | 1048 g | 200.5 × 105 × 24 mm | Recorded fields | View model details |
| Reference model 06 | Conflicting records — confirm
| Conflicting records — confirm
| 100 W | GaN | SMA → N | 700 g | 175 × 84 × 24 mm | Confirmation required | View model details |
| Reference model 07 | Conflicting records — confirm
| Conflicting records — confirm
| 30 W | GaN | SMA → SMA | 295 g | 160 × 50 × 20 mm | Confirmation required | View model details |
| Reference model 08 | 100–1000 MHz 1–3 GHz Revision 2 | Notation requires confirmation
| 30 W | GaN | SMA → SMA | 396 g | 162.65 × 52.5 × 20 mm | Confirmation required | View model details |
| Reference model 09 | 3–6 GHz | 1 GHz / 2 GHz / 3 GHz | 30-40 W | GaN | SMA → SMA | 294 g | 160 × 50 × 19 mm | Confirmation required | View model details |
| Reference model 10 | 100 MHz-2.4 GHz | Bandwidth300–400 MHz | 50 W | GaN | SMA → N | 425 g | 155 × 58 × 22 mm | Recorded fields | View model details |
| Reference model 11 | Conflicting records — confirm
| Conflicting records — confirm
| Conflicting records — confirm
| GaN | SMA → N | 1351 g | 220 × 110 × 26 mm | Confirmation required | View model details |
| Reference model 12 | 300 MHz-2 GHz Revision 2 | 1.7 GHz | 100 W | GaN | SMA → N | Not provided — confirm | 240 × 118 × 25 mm | Confirmation required | View model details |
| Reference model 13 | Notation requires confirmation
| 900 MHz | Conflicting records — confirm
| GaN | SMA → N | 880 g | 200 × 100 × 20 mm | Confirmation required | View model details |
| Reference model 14 | 1–2 GHz | Bandwidth1 GHz | 80 W | GaN | SMA → SMA | 724 g | 200 × 100 × 20 mm | Confirmation required | View model details |
| Reference model 15 | 1–6 GHz 1–6.2 GHz Revision 2 power claim requires validation | Bandwidth5 GHz | 100 W | GaN | SMA → N | 1830 g | 250 × 150 × 25 mm | Confirmation required | View model details |
| Reference model 16 | 4–8 GHz Revision 2 | 4 GHz | 50 W | GaN | SMA → SMA | Conflicting records — confirm
| Conflicting records — confirm
| Confirmation required | View model details |
| Reference model 17 | 1–3 GHz | 2 GHz | 50 W | GaN | SMA → N | 977 g | 220 × 77 × 24 mm | Confirmation required | View model details |
| Reference model 18 | Conflicting records — confirm
| Not provided — confirm | Variant rating requires confirmation
| GaN | SMA → SMA silver-plated connectors | 278 g | 105 × 60 × 20 mm | Confirmation required | View model details |
| Reference model 19 | 4–8 GHz | 4 GHz | 100 W | GaN | Conflicting records — confirm
| 1193 g | 160 × 160 × 25 mm | Confirmation required | View model details |
| Reference model 20 | 2–7.2 GHz | 5.2 GHz | 50 W | GaN | Conflicting records — confirm
| Not provided — confirm | 160 × 160 × 25 mm | Confirmation required | View model details |
| Reference model 21 | 2–7.2 GHz | 5.2 GHz | 100 W | GaN | SMA → SMA | 2569 g | 240 × 220 × 25 mm | Recorded fields | View model details |
| Reference model 22 | Notation requires confirmation
| Conflicting records — confirm
| Conflicting records — confirm
| GaN | N | 778 g | 226 × 74 × 22 mm | Confirmation required | View model details |
For lawful civilian communications, laboratory equipment and industrial research. These records are not installation instructions, interference settings, a safety assessment or a certification claim. The original workbook and internal engineering notes are not public downloads.
01 / THE MODULE APPROACH
A building block, not a black box system.
An RF power amplifier increases the power of an incoming radio-frequency signal. A module packages that amplification stage for integration into a larger piece of equipment, rather than replacing the complete system.
02
Device technology choices
GaN and LDMOS provide different foundations for an amplifier design. The useful comparison is how the complete module fits the intended signal and equipment—not the semiconductor name alone.
03
Integration-led packaging
The module format brings the amplifier into a defined physical assembly. Enclosure layout, connection access and the host equipment’s mechanical arrangement are practical parts of a product discussion.
04
A clear customization path
Start with the civilian use case and the surrounding equipment. Discuss mechanical fit, interface arrangements and the support needed to turn an initial concept into an agreed project scope.
02 / PRODUCT FAMILY
One category. Different module formats.
The product family brings together several enclosure shapes and connection layouts. Explore the physical formats as a starting point for engineering and purchasing discussions.
PRODUCT FAMILY / MODULE FORMATS
Physical format
Different enclosure proportions can suit different equipment layouts.
Connection layout
Interface placement is a distinct part of each module’s integration context.
Project fit
Use the family as a starting point, then discuss a specific assembly with the team.
03 / TECHNOLOGY OPTIONS
Two semiconductor paths. A system-level choice.
GaN and LDMOS refer to the transistor technology inside an amplifier. Neither label, on its own, describes the performance of a finished module.
01
GaN
Gallium nitride
A compound-semiconductor technology used in RF power devices. It is often considered where compact RF power stages and broadband design are important to the equipment concept.
Discussion lens: the intended signal, physical packaging and overall equipment requirements.
02
LDMOS
Laterally diffused metal-oxide-semiconductor
A silicon transistor technology with a long-established role in RF amplification. It offers another design path for communications equipment and other RF systems.
Discussion lens: the communications use case, existing equipment architecture and project priorities.
Compare complete module designs in the context of your application; technology labels are not a universal ranking.
04 / CIVILIAN APPLICATIONS
From connected equipment to the research bench.
Three civilian contexts in which a dedicated RF amplification stage can be part of the wider equipment design.
Communications
RF amplification within communications equipment and wireless development platforms. A module can form one stage of a transmit chain, alongside the equipment’s other signal-handling components.
Laboratory & test
Amplification of laboratory signal sources for RF experiments and equipment evaluation. The amplifier belongs within the lab’s complete measurement setup and test plan.
Industrial research
RF subsystems for industrial instrumentation research and prototype equipment. Module-level packaging lets teams consider the amplifier alongside the wider mechanical and electronic assembly.
05 / CUSTOMIZATION SCOPE
Shape the conversation around your equipment.
Customization starts with understanding the host product and the purpose of its RF stage. These are the areas to bring into an initial discussion with New Ark.
- Enclosure & mechanical fit
- Available space, the surrounding assembly and how the module needs to fit within the host equipment.
- Interfaces & connection layout
- Connection access, interface expectations and the boundaries between the module and the rest of the equipment.
- Technology & product scope
- The intended civilian application and whether a GaN or LDMOS design path belongs in the product review.
- Documentation & support
- The module information, review records and engineering coordination your team needs for its project.
Module-specific enclosure, interface and support arrangements are confirmed in the written project scope.
06 / COMMON QUESTIONS
Before you start a module discussion.
Is this a standalone RF instrument or a module?
This category covers amplifier modules intended to become part of larger equipment. An enclosure does not make a module a complete laboratory instrument or communications system; the surrounding equipment and integration responsibilities still matter.
What is the difference between GaN and LDMOS?
GaN means gallium nitride; LDMOS means laterally diffused metal-oxide-semiconductor. They are different transistor technologies used in RF power amplification. A suitable choice depends on the complete module design and application, rather than one technology being universally better.
Are these passive amplifier modules?
No. An RF power amplifier needs an external electrical supply and is an active electronic device. The word “passive” does not correctly describe powered amplification, even if a module has no extra control or monitoring features.
What should I share for a customization discussion?
Start with your civilian application, the module’s role in your equipment, the available mechanical space and the interface or documentation questions you want to resolve. The custom project team can coordinate the next review; the agreed configuration and support belong in the written scope.
07 / CONSULTATION
The right conversation, with the right team.
Choose a contact based on what you need to discuss. All three links open WhatsApp directly—no registration or enquiry form required.
01 / WhatsApp
Sales enquiries
Product-family enquiries, quotations and commercial discussions.
+86 19928199130Message sales02 / WhatsApp
Technical support
Module questions, product documentation and technical clarification.
+86 18123677761Message technical support03 / WhatsApp
Custom projects
A project-specific discussion about mechanical fit, interfaces and support scope.
+85295658748Message the project team